A central theme is the joining of different materials. It covers high-temperature fusion bonding and, most notably, anodic bonding (joining silicon to glass using heat and electric fields).
The book provides a detailed look at the fabrication and utility of silicon-glass hybrid structures, which are critical for creating miniaturized sensors and actuators. Major topics include: J.Dziuban - Technologia i zastosowanie mikromec...
Implementation of these structures in practical devices like accelerometers, pressure sensors , and micro-turbines. Related International Work A central theme is the joining of different materials
Applications in Micro Total Analysis Systems (lab-on-a-chip), such as microchannels for chemical analysis and medical diagnostics. Major topics include: Implementation of these structures in
The work titled (Technology and Application of Micromechanical Silicon and Silicon-Glass Structures in Microsystems Technology) is a comprehensive monograph by Jan A. Dziuban , published by the Wrocław University of Science and Technology (Oficyna Wydawnicza Politechniki Wrocławskiej) in 2002 and 2004 .
If you are looking for an English-language version of this research, Jan Dziuban also authored (published by Springer), which is considered the first compendium specifically detailing deep wet etching and bonding techniques for silicon/glass microsystems.