: Usually 20°C to 40°C above the solder's melting point.
, officially titled Guidelines for Temperature Profiling for Mass Soldering Processes , is the industry standard for creating and managing thermal profiles in electronics manufacturing. It ensures that all solder joints reach the necessary temperatures for metallurgical bonding without damaging heat-sensitive components. IPC-7530
: The duration the solder remains in a liquid state. : Usually 20°C to 40°C above the solder's melting point
: Gradually increasing the temperature to avoid thermal shock to the PCB or components. IPC-7530